Data Center Cooling
Advanced Thermal Management: High-Efficiency Cooling Fluids for Next-Generation Data Centers
As high-density computing and AI workloads push traditional air cooling to its limits, CS Homie Hardware provides the specialized chemistry required for modern thermal management. Strategically based in Johor to support the rapid expansion of the Singapore-Malaysia data center corridor, we supply premium heat transfer fluids—including Jeffcool ISF-25 and ExxonMobil EMDC. Our solutions are engineered to enhance heat dissipation, extend hardware lifespans, and significantly reduce operational energy costs for Tier III and Tier IV facilities.
The Future of Data Center Cooling: Efficiency & PUE Optimization
In the modern digital landscape, traditional air cooling is no longer sufficient for high-density AI and machine learning workloads. At CS Homie Hardware, we provide the specialized fluids required to transition from legacy systems to high-efficiency Liquid Cooling architectures.
Why Choose Liquid Cooling Fluids?
Traditional air cooling consumes up to 40% of a data center’s total power. By switching to liquid-based solutions like Direct-to-Chip (DLC) or Immersion Cooling, facilities can achieve a Power Usage Effectiveness (PUE) as low as 1.02.
Superior Thermal Conductivity: Liquids like JeffCool ISF-25 and ExxonMobil EMDC can absorb and transport heat up to 3,500 times more effectively than air.
Corrosion Protection: Our inhibited glycols are engineered with advanced additive packages that protect sensitive metals (copper, aluminum, brass) from scaling and degradation.
Hardware Longevity: By maintaining a stable, lower operating temperature, our cooling fluids reduce thermal stress on CPUs and GPUs, extending the life of your expensive IT assets.
Direct-to-Chip (DLC) Solutions
Jeffcool ISF-25, a high-performance inhibited propylene glycol specifically inhibited to protect cold plate systems from corrosion and bio-fouling
- Intel-Compliant Performance: Specifically engineered to meet the stringent requirements for Direct-to-Chip (DLC) cooling, making it a trusted standard for high-performance server architectures.
- Superior Thermal Efficiency: Formulated with a 25% inhibited propylene glycol concentration to provide higher thermal conductivity and heat capacity compared to higher-concentration fluids, maximizing heat removal from CPUs and GPUs.
- Advanced Corrosion Protection: Features a robust inhibitor package designed to safeguard critical wetted materials, including copper, brass, titanium, and stainless steel, preventing galvanic corrosion and extending hardware lifespan.
- Ready-to-Use (RTU) Formula: Pre-diluted with high-purity deionized water to ensure precise concentration and chemical balance, eliminating the risk of site-side contamination during filling.
Single-Phase Immersion Cooling
Supplying ExxonMobil EMDC (Electro-Mechanical Dielectric Cooling) fluids, designed for superior material compatibility and high dielectric strength in fully submerged server environments
- Exceptional PUE (Power Usage Effectiveness): Engineered to drive PUE as low as 1.02 to 1.03. By eliminating energy-heavy server fans and facility CRAC/chiller units, it can reduce total data center energy consumption by up to 40%.
- Intel Data Center Certified: One of the few immersion fluids to receive the Intel Data Center Certified designation. This validation (tested with 4th and 5th Gen Xeon processors) provides operators with the confidence of an Intel-backed warranty rider for submerged hardware.
- High Thermal Stability & Specific Heat: Formulated with advanced synthetic hydrocarbons (PAO-based) that offer superior heat absorption and dissipation compared to traditional air cooling, enabling the management of high TDP (Thermal Design Power) chips exceeding 800W.
- Superior Dielectric Strength: High breakdown voltage and non-conductive properties ensure total safety for direct contact with sensitive electronic components, preventing electrical arcing or short circuits.
Submit Your Enquiry
Reach Us
Location :
Johor Bahru, Johor, Malaysia
Email :
admin@cs-homie.com
Phone :
+60132778687
+60149434113